Mold-Tek Packaging sets bonus issue record date

Mold-Tek Packaging sets bonus issue record date. The company has fixed 09-Oct-2026 as the record date for its bonus share issuance. This follows the earlier announcement of a 1:1 bonus issue, rewarding existing shareholders. Investors must hold shares until the record date to qualify.

📊 STOCKS: $MOLDTKPAK | 🏢 SECTOR: Packaging | #LOWIMPACT #Bonus